FIB/SEM (Operational)
FEI Versa 3D dual-beam FIB/SEM (focused ion beam/scanning electron microscope) system is the most versatile high-resolution FIB/SEM for 2D and 3D material characterization and analysis. The instrument combines innovative electron and ion optics. Field emission electron beam optics with NG Schottky emitter sourceis optimized for high brightness/high current, providing low-noise imaging and field emission focused ion beam optics with liquid Gallium ion emitter has fast high-volume milling capabilities. Capabilities: 1. Micro Machining The site specific nature of the dual-beam system milling capability allows preparation and processing of materials in ways that are limited only by one's imagination. It can machine graphics, such as concave, convex, rectangular, spherical or irregular shape.
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A primary advantage to the lift-out technique over other specimen preparation methods is that specimens may be prepared from the starting bulk sample with little or no initial specimen preparation. The lift-out method also has significant implications in the overall analytical approach to a site-specific problem. Besides, the lift-out technique is very useful for TEM sample preparation and often used to lift out the sample and in-situ combination. | |
EasyLift NanoManipulator transfer gasket and diamond |
3. Scanning Electron Microscope (SEM): Qualitative chemical analysis and/or crystalline structure; Chemical analyses using EDS; Mapping to analyse the grain size, grain boundary, grain orientation and texture using EBSD.
4. CVD deposition or enhanced etching: 4 gas injector system for in-situ deposition and enhanced etching of carbon-based materials such as resist, polycarbonate or diamonds.
Potential research directions: Material Science, Chemistry, Physics, Earth Science.
Contact: Yanping Yang (Yanping.yang@hpstar.ac.cn)
Ref: Giannuzzi and Stevie, "Introduction toFocused Ion Beams: Instrumentation, Theory,Techniques, and Practice" (Springer, New York,2005)